Wafer Metrology – The technology  / Making Values Visible

Our core competence is the deep understanding of the processes during the whole process chain of manufacturing of the semiconductor industry. Thus, our technology uncovers the chemical and physical impact of processes with analysis methods as laser-based measurements and VPD processes. In view of contamination and structural damage the quality of existing processes can be evaluated as well as new process parameters in the process development.

 
 
 

Immediate Contact

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PVA TePla Korea
B3126,3127, 27
Dongtancheomdansaneop 1-ro,
Hwaseong-si
Gyeonggi-do 
18469

Phone: +82 31 723 0301
Fax: +82 31 723 0302