The PlasmaPen™ is a self-contained unit that operates at atmospheric pressure. Its patented design keeps high voltages and current safely inside of the pen body, away from the plasma jet and substrate surfaces. Surface cleaning and activation with the PlasmaPen™ ensures a reliable wire and die bonding in semiconductor packaging. It has found particular success in adhesion promotion of anisotropic conductive film (ACF) used in flat panel display manufacturing to name a few.
