The IoN series plasma systems feature various radio frequency options to meet our customer‘s specific process and throughput requirements. We offer various electrode configurations with both small and large chamber sizes up to 1200 liters.
PVA TePla’s IoN 10Q is a table top fully featured RF plasma system used for batch Wafer Ashing and Descum and is designed for both laboratory and production use of a maximum of 25 wafers with wafer sizes up to 150mm.
PVA TePla’s IoN 100-40Q is a fully featured RF plasma system used for batch Wafer Ashing and Descum and is designed for both laboratory and production use of a maximum of 50 wafers with sizes up to 200mm.
PVA TePla’s IoN Single Wafer Asher is a fully featured advanced RF plasma system used for single Wafer Ashing and Descum and is designed for both laboratory and production use for wafers up to 200mm.
PVA TePla’s IoN 200 is a fully featured advanced RF plasma system used for surface modification and is designed for both laboratory and production use for large substrates or high-volume throughput. The system also provides unique features for PECVD applications.
PVA TePla’s IoN 40 is a fully featured table top advanced RF plasma system used for surface modification and is designed for both laboratory and production use for smaller substrates or small or medium throughput. The system also provides unique features for PECVD applications.