Batch Packaging Systems

The plasma system GIGA 690 is the successor model to the PS400 and PS660 and has become well established on the market since its launch in 2008. As a low-pressure microwave plasma system, it is designed for the cleaning and activation of semiconductor components in chip packaging, including before die-attach, wire bonding, flip-chip underfilling, and encapsulation. To this end, microwaves of 2.45 GHz are introduced through a window into the vacuum chamber, where they generate a chemically reactive plasma. This process allows particularly fast and damage-free plasma treatment.

The system can be operated both in manual and automatic mode; its user-friendly software meets the SEMI standards.